Semiconductor Packaging News
A research team led by Hyeong-U Kim at KIMM has achieved a world-first: fabricating 4-inch heterostructure semiconductors using PECVD technology. This innovation enables low-power, high-performance AI semiconductors, enhancing efficiency & …
Semiconductor Packaging News
Advanced Packaging Driving New Collaboration Across Supply Chain. The semiconductor industry's shift to advanced packaging, including chiplets and heterogeneous integration, fuels innovations in AI, 5G, and automotive fields. Industry leaders stress that collaboration is crucial to meet performance demands and tackle complex challenges.
Semiconductor Packaging News Index
Although House Speaker Johnson initially suggested ... CNBC. Nov 8, 2024. SUMMARY. Semiconductor firms ASML, AMD, Qualcomm reaffirm China commitment at CIIE trade fair. At Shanghai's CIIE trade fair, global semiconductor giants like ASML, AMD, and Qualcomm showcased advanced tech products, reaffirming their commitment ... South China Morning Post.
Semiconductor Packaging News
October 31, 2024. Back-end Semiconductor Equipment: Advanced Packaging to Propel the Market. The back-end semiconductor equipment market, essential for assembly and packaging, is set to grow in 2025, driven by AI investments and advanced packaging demands. Despite recent declines, revenue should rebound as AI and high-performance computing ...
Worldwide Silicon Wafer Shipments Increase 6% in Q3
Worldwide Silicon Wafer Shipments Increase 6% in Q3 2024, SEMI Reports. Silicon wafer shipments grew 5.9% in Q3 2024 to 3,214 million square inches, with annual growth of 6.8%, driven by strong AI demand. SEMI SMG forecasts continued growth into …
The Evolution of Interconnects in Microelectronics Packaging
3 days ago · The Evolution of Interconnects in Microelectronics Packaging. Advances in semiconductor packaging, including hybrid bonding and heterogeneous integration, push critical interconnect innovations like direct copper & solder alternatives, boosting signal integrity. These breakthroughs fuel miniaturization & enhance performance in flexible electronics.
Advanced Packaging Driving New Collaboration Across Supply Chain
Advanced Packaging Driving New Collaboration Across Supply Chain. Summary. The semiconductor industry's shift to advanced packaging, including chiplets and heterogeneous integration, fuels innovations in AI, 5G, and automotive fields. Industry leaders stress that collaboration is crucial to meet performance demands and tackle complex challenges.
Advanced Packaging Drives Test And Metrology Innovations
2 days ago · Advanced Packaging Drives Test And Metrology Innovations. Summary. The semiconductor industry's pivot to advanced packaging pushes engineers to tackle performance, thermal & signal challenges. High-density, high-frequency demands in AI-driven computing require innovative testing & thermal solutions to ensure reliability, peak performance ...
Wafer Shipments Remain Soft in 2024 Before Strong Expected …
Global silicon wafer shipments are projected to decline by 2% in 2024 but will rebound with a 10% growth in 2025. Rising demand for AI and advanced processing, along with new applications in packaging and memory, will drive growth through 2027. The dedicated team at Semiconductor Packaging News has provided this summary for your convenience.
TSMC/Amkor U.S. Advanced Packaging Partnership; Reshoring at …
TSMC/Amkor U.S. Advanced Packaging Partnership; Reshoring at IMAPS 2024. Summary. TSMC has signed a memorandum with Amkor Technology to provide advanced packaging and test services for its Arizona plants. Both companies secured CHIPS Act funding to support their facilities, accelerating chip production and packaging for U.S. customers. 3DInCites.