News

Semiconductor Engineering3h
Overview Of The End-to-End Autonomous Driving through V2X Challenge (Tsinghua, HK Univ., Stanford, TU Munich et al.)
A new technical paper titled “Research Challenges and Progress in the End-to-End V2X Cooperative Autonomous Driving ...
Semiconductor Engineering3h
LLM Inference: Core Bottlenecks Imposed By Memory, Compute Capacity, Synchronization Overheads (NVIDIA)
Bandwidth, Compute, Synchronization, and Capacity are all you need” was published by NVIDIA. Abstract “This paper presents a ...
Semiconductor Engineering3h
Challenges And Outlook of Photonic-Integrated Circuit Packaging (Hanyang Univ.)
A new technical paper titled “Advanced Optical Integration Processes for Photonic-Integrated Circuit Packaging” was published ...
Semiconductor Engineering6h
Statistical BER Analysis For Two Types Of Communication Systems In Chiplet Integration (TSMC)
An new technical paper titled “Fast and Accurate Jitter Modeling for Statistical BER Analysis for Chiplet Interconnect and ...