NVIDIA's demand for advanced packaging from TSMC, but the tech it needs is changing: Jensen Huang says NVIDIA will transition ...

During the inauguration ceremony of SPIL on January 16, Nvidia founder and CEO Jensen Huang stated that the Blackwell system ...

As Nvidia ramps up production of its multi-chiplet Blackwell-series products, the company will use more CoWoS-L packaging capacity and less CoWoS-S packaging capacity, the company's chief ...

Speaking on the sidelines of an event hosted by chip supplier Siliconware Precision Industries in Taichung, Taiwan, Huang explained the transition in Nvidia's chip packaging requirements.

Nvidia is moving the production of its Blackwell chips from TSMC's CoWoS-S to CoWoS-L advanced packaging technology.

It's actually increasing capacity into CoWoS-L." Hopper refers to Nvidia's GPU architecture platform before it announced Blackwell in March 2024. Nvidia has so far relied mainly on one type of ...

"So it's not about reducing capacity. It's actually increasing capacity into CoWoS-L." Hopper refers to Nvidia's GPU architecture platform before it announced Blackwell in March 2024. Nvidia has so ...