Micron (MU) broke ground on a new high-bandwidth memory advanced packaging facility adjacent to the company’s current facilities in Singapore.

Today, Micron Technology has started constructing its multi-billion-dollar packaging facility for high-bandwidth memory (HBM) ...

The US semiconductor company has commenced construction on a new high-bandwidth memory advanced packaging facility.

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Set to start operating in 2026, the plant will be used to package high-bandwidth memory chips, a type widely seen in AI data ...