The ratio of orders fulfilled by Taiwanese manufacturers overseas has consistently declined over the past several years after ...

US President Donald Trump on Tuesday announced a major investment to build infrastructure for artificial intelligence (AI) ...

Discussions also took place on next-generation advanced packaging technology (CoWoS-L) necessary for AI accelerator manufacturing, as well as processes that are nearing commercialization, such as ...

TSMC is planning to build two new CoWoS facilities at the Phase III site of Southern Taiwan Science Park (STSP).

Nvidia is moving the production of its Blackwell chips from TSMC's CoWoS-S to CoWoS-L advanced packaging technology.

Speaking on the sidelines of an event hosted by chip supplier Siliconware Precision Industries in Taichung, Taiwan, Huang explained the transition in Nvidia's chip packaging requirements.

NVIDIA's demand for advanced packaging from TSMC, but the tech it needs is changing: Jensen Huang says NVIDIA will transition ...

Nvidia CEO shortens visit due to crowding, also visited Siliconware Precision Industries | Jan. 17, 2025 18:31 ...

Nvidia's most advanced artificial intelligence (AI) chip, Blackwell, consists of multiple chips glued together using a ...

TSMC CEO C.C. Wei has dismissed recent market speculation indicating Nvidia is cutting back its demand for ...

During the inauguration ceremony of SPIL on January 16, Nvidia founder and CEO Jensen Huang stated that the Blackwell system ...

The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.