TL;DR: NVIDIA’s B300 AI chip production is accelerated to May, utilizing TSMC’s advanced 5nm N4P process and CoWoS-L packaging. Featuring Bianca compute boards with 1 CPU and 2 GPUs ...

GPUs and other AI chips have been instrumental in driving growth in performance of top AI systems, providing compute needed ...

Nvidia announced plans today to manufacture AI chips and build complete supercomputers on US soil for the first time, commissioning over one million square feet of manufacturing space across Arizona ...

Nvidia said it is working with its manufacturing partners to build factories that will produce AI supercomputers in the U.S.

Investing.com-- Taiwan Semiconductor Manufacturing Co, or TSMC, is close to finalizing specifications for an advanced approach to chip packaging in order to meet demand for more power artificial ...

In the coming years, TSMC plans to build five more fabs on the site along with two advanced packaging facilities. Nvidia is also partnering with several other suppliers on its new stateside ...

The company is currently building a production line for the advanced packaging at a plant in Taoyuan, Taiwan, with small batches of production expected to start around 2027. Chip packaging ...

The AI chip and supercomputer supply chain is complex and demands the most advanced manufacturing, packaging, assembly and test technologies. NVIDIA is partnering with Amkor and SPIL for packaging ...

While chips are generally built on 300-millimeter round wafers, TSMC's new technology, referred to in the industry as "panel-level" advanced chip packaging, will use a square substrate that can ...

Nvidia CEO Jensen Huang announced a $500 billion investment in U.S. AI infrastructure, marking the company's first domestic ...