The US semiconductor company has commenced construction on a new high-bandwidth memory advanced packaging facility.

After an underwhelming end to last year, Micron Technology Inc. shares have been hot to start 2025, rising 18% to lead S&P ...

The company has plans to demo its next-gen 16-layer HBM3E prototype alongside a high-capacity enterprise SSD, and new ...

Explore the NVIDIA GeForce RTX 5090: unmatched power, advanced cooling, and next-gen connectivity for gamers and ...

Micron Technology has started constructing its multi-billion-dollar packaging facility for high-bandwidth memory (HBM) in ...

Micron Technology (MU) said it broke ground on a new High-Bandwidth Memory, or HBM, advanced packaging facility in Singapore.

Micron (MU) broke ground on a new high-bandwidth memory advanced packaging facility adjacent to the company’s current facilities in Singapore.

Micron Technology Inc. is investing $7 billion over the next several years to expand its manufacturing footprint in Singapore ...

Micron Technology is investing $7 billion to build an advanced chip packaging facility in Singapore as the semiconductor ...

Micron Technology initiated construction on (January 8, 2025) of a new High-Bandwidth Memory (HBM) advanced packaging ...

Talk about artificial intelligence and you immediately think about Nvidia (NASDAQ:NVDA), Broadcom (NASDAQ:AVGO), or even ...

Micron’s data center revenue surged 4X YoY and 40% sequentially in Q1-FY25, contributing 55% of consolidated revenue. High ...