When two materials that exhibit different thermal expansion behaviors are in direct contact, such as an adhesive and adherend, warping or internal stress may occur, eventually leading to joint ...

Its thermal conductivity is >11 BTU/in/ft 2 /hr/°F [1.5865 W ... flip chip attachments. This ROHS compliant adhesive has a non-drip, paste viscosity and is easy to apply manually or automatically.