The new packaging method developed by LG Innotek places copper columns on the substrate before solder balls are applied on top, rather than bonding the balls directly to the surface. The resulting ...

Flip chip lidded ball grid array (FCLBGA) packaging technology, which is commonly used in high-performance computing ...

Team India Unlikely To Tour Bangladesh For White Ball Series Due To Political Tension: Report The root cause of the disruption lies in ongoing domestic unrest in Bangladesh, triggered in part by ...

The default balls are made of lead-free solder, and [MadEDoctor] reballed the RAM chip with leaded solder balls to lower the melting point, but it’s by no means a requirement that you do the same.

Test fixtures are becoming more important in 5G, 6G, and phased-array designs. This article explains methods to optimize test setups for a PCB signal launch and interconnect design, including ...