With FPGA packages exceeding 1,000 pins, with Ball Grid Array (BGA) solder bumps providing the interconnect, it is vitally important to make solid contact with the Printed Circuit Board (PCB).

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solder paste with BGA components that feature low-temperature solder (LTS) balls. A traditional SAC reflow profile is used for soldering, which results in a homogeneous SAC-LTS solder joint. This ...