Conventional flexible PCBs, built around plastic polyimide, are also ripe for alternative materials. Polylactic acid, ...

Nexperia’s new X.PAK packaging combines high thermal performance, compact size, and easy assembly for high-power applications ...

which has titanium and silica in the white solder mask. Figure 1. Electrochemical migration (dendrite) short of copper on printed circuit board. LIBS analysis (laser-induced breakdown spectroscopy) is ...