Multi-die designs introduce new engineering complexities and design considerations spanning packaging, verification, and ...

When a bathroom scale gives you multiple different weight-measurement results, is it cheating if you pick the lowest outcome?

It will be fascinating to see which GPS alternatives, if any, take a dominant role in non-GPS settings, or will it be a ...

The move toward 3D ICs and heterogeneous integration overcomes limitations of 2D scaling by integrating multiple specialized ...

The chiplets design combines IP access, interposer expertise, and relationships with HBM suppliers, foundries and OSATs ...

A DC/DC power delivery board from Navitas Semiconductor enables direct conversion from 800 V to 6 V in a single stage.

Multi-die design teams should adopt modular principles, utilize proven IP blocks with D2D support, and implement automated ...

Infineon’s XDPE1E multiphase PWM buck controllers and TDA49720/12/06 PMBus POL regulators streamline voltage regulation in AI ...

Figure 3 Rail voltage delay and rise time speedup. This worked predictably down to arbitrarily low power supply voltages ...

Baluns enable impedance matching, minimize signal distortion, and suppress common-mode noise in RF and high-frequency designs ...

Why chiplets and why now? A special section at EDN provides a detailed treatment of this revolutionary silicon technology ...

An archaic DieHard device has seemingly died hard; is hacking it to resurrect a portion of its original function a worthwhile endeavor?