Teradyne has partnered with ficonTEC, a global leader in production solutions for photonics assembly and test, to announce ...

Naturally, it’s far easier and cheaper if a GaAs laser can be grown directly on the silicon die, which is what researchers ... standard 300 mm silicon wafers. The trick was to accept the lattice ...

Lightmatter turbocharges GPU connectivity with its first photonics-based networking interconnects - SiliconANGLE ...

Markets calling for ultrathin wafers are growing. The combined thickness of an HBM module with 12 DRAM dies and a base logic chip is still less than that of a prime silicon wafer. Thin wafers also ...

The chip maker is reportedly producing initial runs of its most advanced chips ever produced, the 18A wafers, at its Arizona factory. Intel Corp. is reportedly producing initial runs of its 18A ...

By enabling high-throughput electro-optical testing of silicon photonic wafers, this solution addresses the critical need for known good die testing before wafers are diced and packaged into CPO ...