In contrast to canonical redundancy analysis, which examines how well the original variables can be predicted from the canonical variables, maximum redundancy analysis finds the variables that can ...

Three-dimensional (3D) memory integration marks a significant advancement in semiconductor technology, enabling higher device densities and enhanced performance for modern applications. However, the ...

Design teams—whether using fabless, fablite, or IDM(integrated-device-manufacturer) processes—should handle the goal of reducing a design’ssensitivity to manufacturing issues. The furtherdownstream a ...

In the semiconductor industry, optimizing Power, Performance, and Area (PPA) is a key challenge for designers and architects. Balancing these three factors often involves making trade-offs. Improving ...